PC – Black – Bambu Lab
Product Features
Exceptional heat resistance
Excellent mechanical properties
High impact strength and durability
Suitable for engineering applications
Comes with high temperature reusable spool
Diameter: 1.75mm +/- 0.03mm
Compatibility of accessories
| Recommended | Not Recommended | |
| Build Plate | Engineering Plate, High Temperature Plate or Textured PEI Plate | Cool Plate |
| Hotend | All Size / Material | / |
| Glue | Glue Stick | Bambu Liquid Glue |
Compatibility of accessories
All print parameters are embedded in the RFID, which can be read via our AMS (Automatic Material System).
Load and print! No more tedious setup steps.
Recommended print settings |
|
| Drying Settings (Blast Drying Oven) | 80 °C，8h |
| Printing and Keeping Container’s Humidity | < 20% RH (Sealed, with Desiccant) |
| Nozzle Temperature | 260 – 280 °C |
| Bed Temperature (with Glue) | 90 – 110 °C |
| Printing Speed | < 300 mm/s |
Physical properties |
|
| Density | 1.20 g/cm³ |
| Vicat Softening Temperature | 119 °C |
| Heat Deflection Temperature | 117 °C |
| Melting Temperature | 228 °C |
| Melt Index | 32.2 ± 2.9 g/10 min |
Mechanical properties |
|
| Tensile Strength | 55 ± 4 MPa |
| Breaking Elongation Rate | 3.8 ± 0.3 % |
| Bending Modulus | 2310 ± 70 MPa |
| Bending Strength | 108 ± 4 MPa |
| Impact Strength | 34.8 ± 2.1 kJ/m² |
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